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27 Jun 2020

28 Jun 2020

 

3rd International Conference on Empirical Evidence on Engineering, Basic and Applied Sciences Research EEAS-2020     (33 Views)     

Event Serial No.-  WLD136018
Website  
Contact Person - Michael Sasaoka
Event inquiry /Organizer email address - eeas@consortium-et.com
Deadline for abstracts/proposals: 2020-06-17
Organized by: Consortium of Engineering & Technology View more Conference
Venue: Osaka,  Japan,  Japan

About Event


Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.
Topic Covered: Engineering Engineering , Nanotechnology and Smart Materials , Robotics , Artificial Intelligence , Information Technology ,
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