26 Aug 2021 28 Aug 2021 ![]() |
2021 International Conference on Biomedical Materials and Science IC-BMS 2021 (116 Views) |
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Event Serial No.- WLD216633 |
Website http://www.ic-bms.org |
Contact Person -
Ms. Alice Liu Event inquiry /Organizer email address - [email protected] |
Deadline for abstracts/proposals: 2021-05-05 |
Organized by: Innovative Science and Engineering Research Institute ISERI View more Conference |
Topic Covered: Biomedical Engineering Architecture , Bioinformatics , Biotechnology , Computing , Design , Engineering , Image Processing , Internet and World Wide Web , Military , Nanotechnology and Smart Materials , Polymers and Plastics , Robotics , Systems Engineering , Artificial Intelligence , Biomedical Engineering , Computer software and applications , Data Mining , Energy , Forestry , Information Technology , Manufacturing , Mining , Networking , Renewable Energy , Space Environment and Aviation Technology , Transport , Electronics and Electrical , Smart Materials , Aviation Technology , Agriculture , Archaeology , Biodiversity , Chemistry , Ecology , GIS , Meteorology , Physics , Waste Management , Aquaculture , Astronomy , Biology , Earth Sciences , Environment , Genetics , Oceanography , Soil , Water , |
Venue:
Kyoto, Japan ,
Kyoto,
Japan
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About Event It brings together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of biomedical materials and science IC-BMS 2021. Prof. Masaru Tanaka from Institute for Materials Chemistry and Engineering, Kyushu University, Japan,Prof. Shinichi TOKUNO from Voice Analysis and Measurement of Pathophysiology, Dept. of Bioengineering, Graduate School of Engineering, The University of Tokyo and Lecturer. Yuki Akagi from Department of Bioengineering, Graduate School of Engineering, The University of Tokyo, Japan will give keynote speach. All the registered and presented papers will be published in the volume of IOP- Materials Science and Engineering MSE: Conference Series, which will be submitted to EI Compendex, Scopus, Thomson Reuters WoS, Inspec, and other databases for review and indexing. |
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